Global Quality Package Reliability Engineer

About the role

Micron Technology is hiring a Global Quality (GQ) Package Reliability Engineer to ensure the quality and reliability of semiconductor packages across assigned product lines. The role covers end-to-end coordination of package qualification for new products, new designs, materials and processes, and provides recommendations on product release based on reliability test results.

Key responsibilities

• Lead and coordinate package qualification for new products and process introductions, and develop qualification plans for new technologies.
• Develop reliability test plans to assess risks from excursions, conversions and qualification issues, and recommend screening methods for quality-sensitive lots.
• Maintain and improve monitoring systems for ongoing package quality.
• Drive 8D problem solving, coordinate root cause investigations and corrective actions for qualification failures and customer RMAs, and prepare technical reports for internal and external partners.
• Act as technical liaison for internal teams and external customers on quality and reliability matters, and support customer requests against Micron's quality policies.
• Integrate AI-assisted tools into daily work and share AI-enabled improvements within the scope of work.

Required profile

• Bachelor's or Master's degree in Engineering (Mechanical, Electronics or Materials Science).
• 0-1 years of experience in micro electronic packaging, quality/reliability engineering/testing or failure analysis.
• Good analytical problem-solving, project management, written and verbal communication in English, and digital literacy.
• Self-motivated, meticulous, able to work independently and in cross-functional teams.

Required skills

• Knowledge of semiconductor package assembly and surface mount technology.
• Understanding of thermo-mechanical, mechanical and material interactions affecting reliability in IC components and PCB assemblies.
• Proficiency in reliability test methods, life prediction acceleration models and statistical sampling.
• Familiarity with backend manufacturing software and quality tools such as SPC, FMEA and 8D CAR.