Mechanical Design Engineer – Semiconductor Packaging (SGD 6k-9k)

About the role

We are seeking a Mechanical Design Engineer to develop and improve mechanical systems for advanced semiconductor packaging equipment, including TCB, flip‑chip, and die‑bonding modules. The role involves creating 3D models, detailed drawings, and technical documentation while collaborating with cross‑functional teams.

Key responsibilities

• Design mechanical systems and modules for TCB, flip‑chip, die‑bonding, and related equipment.
• Create 3D models, assembly drawings, BOMs, and technical documentation using CAD tools.
• Develop equipment modules such as wafer handling, die ejection, multi‑axis positioning stages, bondheads, and thermal management structures.
• Select and specify mechanical and motion components (bearings, linear guides, motors, encoders, actuators, sensors, etc.).
• Perform tolerance stack‑up analysis and conduct design reviews for precision assemblies.
• Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.
• Investigate machine issues and implement design improvements to enhance accuracy, reliability, cycle time, manufacturability, and cost.
• Maintain engineering documentation and design‑change records.

Required profile

• Diploma or bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation or related field.
• At least 2 years of mechanical design experience in semiconductor equipment, precision automation, or motion‑system manufacturing.
• Proficiency with 3D mechanical CAD software (e.g., Creo, SolidWorks, Inventor, CATIA, NX).
• Ability to produce detailed manufacturing and assembly drawings.
• Strong understanding of fits, tolerances, GD&T, bearings, linear‑motion components, machining, material selection, and surface treatment.
• Willingness to support assembly, debugging, testing, and continuous improvement activities.

Required skills

• Creo
• SolidWorks
• Inventor
• CATIA
• NX
• Geometric Dimensioning & Tolerancing (GD&T)
• Tolerance stack‑up analysis
• Mechanical CAD
• Semiconductor equipment design

What we offer

• Competitive salary ranging from SGD 6,000 to SGD 9,000 per month (based on experience and capability).
• Opportunity to work on cutting‑edge semiconductor packaging technology.
• Collaborative environment with cross‑functional engineering teams.