MEMS Wafer Fab G5 KKM Process Engineer

About the role

HP is hiring a G5 KKM Process Engineer Specialist in its MEMS Wafer Fab G5 in Singapore. As the technical owner and subject matter expert for the G5 KKM workcenter, you cover Grinder, Stealth Dicer and Separator process technologies and drive the process roadmap, capability improvements and manufacturing excellence initiatives supporting HP's future printhead products.

Key responsibilities

• Own Grinder, Stealth Dicer and Separator technologies and define the process capability roadmap, equipment roadmap and manufacturing standards
• Lead development and qualification of next-generation wafer thinning and singulation processes, using DOE, process modeling, statistical analysis and reliability evaluation
• Partner with Product Development, R&D and Process Integration teams on future manufacturing solutions
• Lead factory-wide initiatives on yield and reliability issues such as wafer thinning TTV variation, wafer breakage, stealth dicing defects, crack propagation, chipping, die separation integrity and mechanical strength
• Lead business continuity planning, including tool redundancy, alternate process qualification, dual sourcing and risk mitigation, and influence supplier roadmaps for equipment, consumables and laser technologies
• Drive factory automation, smart manufacturing, advanced process control and digitalization, and lead strategic continuous improvement projects
• Mentor engineers and technicians, provide technical direction during yield excursions and act as the main escalation point for complex KKM issues
• Work with Manufacturing, Process Integration, Product Engineering, Reliability, Quality, Supply Chain and Equipment Engineering teams

Required profile

• Bachelor or Master degree in Mechanical, Manufacturing, Materials, Electrical or Physics Engineering or a related discipline
• Typically 5-10+ years of experience in semiconductor wafer fabrication, MEMS manufacturing or advanced manufacturing
• Demonstrated track record of improving yield, quality, productivity and manufacturing cost
• Strong technical and project leadership, and ability to communicate across local and global teams
• Able to work in a cleanroom environment and to support overseas collaboration and travel

Required skills

• Deep expertise in wafer backgrinding, thinning, stealth dicing, laser processing and singulation technologies
• Advanced DOE, SPC, FMEA, reliability engineering and process characterization