Package Development Engineering - Product Integration Engineer (PDE PIE)

About the role

Micron is hiring a Product Integration Engineer (PDE PIE) in its Package Development Engineering team. The role owns the product life cycle from new product introduction (NPI) through end of life, acting as technical integrator across manufacturing sites and partners and as the point of contact for the Technical Program Manager.

Key responsibilities

• Integrate AI-assisted tools and insights into daily work and share AI-enablement improvements within your scope of work.
• Drive the NPI phase gate review and coordinate new product start-up to achieve first pass qualification, communicating datelines, applications and customer requirements to the start-up team.
• Work with process, equipment, manufacturing and planning owners to bring new product and package into volume production.
• Support first silicon, engineering samples, qualification samples and engineering hot lots cycle time according to the PDT schedule.
• Monitor product yield trend, quality deviation records and reliability, and initiate early attention if needed.
• Drive closure of electrical failure analysis (EFA) and physical failure analysis (PFA) for NPI issues such as assembly, test and reliability failures.
• Own the product life cycle from NPI to EOL, and collaborate with site owners to develop new technology capabilities ahead of market.
• Act as technical integrator across design, NPI, site process and equipment, package reliability, test and quality, and as the point of contact for the TPM.

Required profile

• Minimum Bachelor's degree in Mechanical, Materials, Aerospace, Chemical, Electrical, Process, Semiconductor or related engineering.
• Fresh graduates with a strong passion for semiconductor engineering are encouraged to apply.
• Internship or experience in the semiconductor industry is a plus; demonstrated leadership and a track record of impact are highly desirable.
• Knowledge of the semiconductor industry and Micron is preferred.

Required skills

• Strong understanding of advanced package assembly flows, die stacking, thin substrates, mold compound, warpage and mechanical reliability.
• NPI qualification frameworks (Qual, low volume manufacturing, post release qualification).
• Hands-on experience with yield analysis, statistical data interpretation, failure analysis and process characterization and validation.
• Familiarity with phase gate / NPI / technology development processes and cross-site manufacturing transfers.
• Ability to use AI-enabled tools responsibly for research, analysis and problem solving.