Package Health Yield Engineer (Senior/Staff/Principal), APTD

About the role

Micron's Advanced Packaging Technology Development (APTD) team develops package development for high-performance memory products and transfers them to manufacturing. The Package Health Test Engineer contributes to package health monitoring, simulation and characterization, working hands-on in DFT, data analysis and reliability testing. The position is open at Senior, Staff or Principal level.

Key responsibilities

• Develop advanced packaging technology strategies focused on test architecture, coverage and yield.
• Define, validate and optimize test coverage for wafer and die level processes.
• Perform electrical characterization and failure analysis of advanced packages, including HBM.
• Identify needs and co-develop new DFTs with cross-functional teams.
• Enhance test fail debugging to meet probe yield targets.
• Contribute to the APTD product roadmap from a test architecture perspective.
• Work with the APTD PI on Test Vehicle (TV) validations, probe coverage definition and readiness for TVs.
• Drive customer test flow readiness with external partners.

Required profile

• Bachelor's or Master's degree in Electrical Engineering or a related field.
• 2+ years of experience in the semiconductor industry on complex products, preferably in product, packaging or test engineering.
• Experience defining test architectures, coverage and managing test/probe yield.
• Strong knowledge of product testing, test architecture and packaging fail modes.
• Proven problem-solving and multitasking skills, and excellent written and verbal communication.

Required skills

• Hands-on experience with simulation tools and test equipment for package characterization and electrical failure analysis.
• Proficiency in AI/ML tools, statistics, data analysis and scripting (e.g., Python, MATLAB, JMP).