Packaging Test Engineer (Advanced Packaging)

About the role

GlobalFoundries is looking for a test engineer to join its Advanced Packaging Process Integration & Yield Enhancement team in Woodlands, Singapore. The role supports electrical test, product characterization and yield-learning for 2.5D and 3D heterogeneous integration technologies, including chiplet packages, interposers, TSV structures, hybrid bonding and multi-die stacking. It involves close collaboration with integration, design, process, product, reliability, equipment and manufacturing teams. Candidates without prior work experience are welcome, as comprehensive training and development will be provided.

Key responsibilities

• Assist in developing, validating and releasing electrical test methods for wafers, dies, interposers, package-level structures and test vehicles.
• Conduct electrical characterization, engineering experiments and data collection under the guidance of senior engineers.
• Help define, qualify and troubleshoot probe cards, sockets, load boards, interface hardware, cables and fixtures.
• Analyze test results with statistical and visualization tools to find trends, outliers, failure signatures and yield-loss mechanisms, and summarize findings for technical reviews.
• Support electrical fault isolation and coordinate with failure analysis, integration, process and reliability teams.
• Assist with test coverage reviews, guardband evaluation, repeatability and reproducibility studies, and correlation of bench, wafer-sort, final-test and reliability data.
• Support development builds, qualification activities, reliability readouts, engineering change evaluations and manufacturing readiness.
• Contribute to cycle-time reduction, test-time optimization, automation, data quality and standardization of test methods and reports.
• Maintain test plans, specifications, procedures, experiment records, data summaries, validation reports and lessons learned.
• Work with unit-process owners on lithography, deposition, plating, etch, CMP, wafer thinning, bonding, dicing, die bonding, underfill, molding and thermal processing, and collaborate with local and global engineering teams, suppliers and manufacturers.

Required profile

• Bachelor's degree in Electrical Engineering, Electronics, Computer Engineering, Microelectronics, Applied Physics, Materials Science, Mechanical Engineering or a related field.
• Basic understanding of semiconductor devices, electrical measurements, circuits and data interpretation.
• Strong problem-solving skills, attention to detail and willingness to learn new technologies.
• Strong written and verbal communication and teamwork skills.
• Preferred: related internship or co-op experience, prior leadership experience, project management skills, interest in AI tools, and exposure to advanced packaging technologies.

Required skills

• Working knowledge of laboratory instruments such as multimeters, oscilloscopes, source-measure units, power supplies and parameter analyzers.
• Ability to analyze structured datasets with Excel, Python, JMP or MATLAB.
• Preferred: exposure to automated test equipment, wafer probing, package final test, bench characterization or test-program development, and knowledge of statistics, DOE, measurement-system analysis, statistical process control or semiconductor yield concepts.