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Principal Dry Etch Engineer / MTS Lead, Advanced NAND Process Development

micron · Fab 10N/X

New
Senior 🇬🇧 English
Plasma Dry Etch High aspect ratio etch Process development

Job description

About the role

Micron is hiring a Principal / MTS-Lead for its next-generation NAND research and development dry etch team. The role drives critical modules and owns the process roadmap to meet program and yield goals, working closely with process integration and areas such as wet etch, CVD, diffusion, metals, lithography and CMP.

Key responsibilities

  • Lead process R&D for assigned products, coordinate projects and resolve yield and defect issues
  • Work with Manufacturing Development Engineering, R&D management, process integration and high-volume manufacturing sites on quality, cycle time and project timelines
  • Drive process and operational efficiency improvements with equipment developers and suppliers, and liaise with equipment and chemical vendors
  • Set and evaluate team performance goals, mentor direct reports and recruit external and internal candidates

Required profile

  • Five years leading a process development team in semiconductor R&D or high-volume manufacturing, or a PhD/Master's with 8 years of semiconductor experience, or a Bachelor's with 15 years
  • Knowledge of high aspect ratio etch development and hard mask requirements
  • Strong communication, problem-solving and relationship-building skills
  • Ability to integrate AI-assisted tools into daily work

Questions fréquentes

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Source : ats:workday

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Published 20 hours ago

Expires 1 month from now

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micron

Fab 10N/X