Principal Engineer - Dry Etch Process Development, NAND

About the role

Micron is looking for a Principal Engineer to provide technical leadership for dry etch process development across critical NAND modules. The role shapes process roadmaps for current and future nodes, leads cross-functional execution to solve high-impact structural and device challenges, and requires deep expertise in plasma etch, proven leadership in complex programs and strong vendor engagement.

Key responsibilities

• Lead dry etch unit process and critical module development, developing processes that meet advanced NAND structural and electrical specifications.
• Lead cross-functional teams to solve complex structural problems and align process areas.
• Present and drive dry etch process and technology roadmaps for current and future nodes.
• Drive advanced scalability solutions for high aspect ratio etches, including pulsing and advanced schemes where applicable.
• Lead supplier head-to-heads and vendor engagements to accelerate process and hardware solutions.
• Mentor peers in dry etch technology and project execution, and give status and risk updates to leadership.
• Use AI-assisted tools to improve efficiency, quality and effectiveness, and share AI-enabled improvements.

Required profile

• PhD with at least 5 years, or Master's with at least 7 years, or Bachelor's with at least 10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field.
• Significant dry etch process development and R&D experience, with evidence of leading complex projects and cross-functional delivery.
• Technical leadership through influence, strong communication and the ability to present roadmaps and program updates.
• Preferred: basic data science knowledge, Python and AI-enabled analysis capability.

Required skills

• Deep understanding of dry etch fundamentals (plasma physics/chemistry, reactor types and chemistries).
• SPC, DOE and statistical analysis, and structured root cause analysis.