Principal Engineer – Front End Product Integration (Uniformity)

About the role

We are seeking a senior engineer to lead uniformity and process integration for front‑end semiconductor modules. The role focuses on end‑to‑end strategies that improve yield, quality and reliability across critical loops such as capacitance.

Key responsibilities

• Lead structural uniformity and cross‑loop integration for critical modules, owning integration strategies to close yield and reliability gaps.
• Collaborate with process owners, subject‑matter experts and suppliers to develop physics‑based integration solutions and meet BIC yield targets.
• Design and apply model‑based root‑cause analysis frameworks (transport, reaction kinetics, pattern density, geometry effects) to diagnose non‑uniformity.
• Define and strengthen inline monitoring and defense lines (critical dimension, film loss, mass delta, defectivity, edge/periphery metrics) for robust uniformity control.
• Maintain deep product integration expertise across node transitions and drive “shift‑left” integration of uniformity, bevel and backside best‑known‑methods.
• Lead global projects, standardize best practices across sites, and improve process efficiency, cycle time and development productivity.

Required profile

• 5+ years of experience in the semiconductor industry.
• Bachelor’s/Master’s/PhD in EE, Materials Engineering, Materials Science, Physics or Chemistry (optional with 8+ years relevant experience).
• Strong understanding of DRAM and NAND structures and ability to interpret parametric, probe and qualification data.
• Logical thinking, solid knowledge of semiconductor fabrication flows and impact of process changes on yield and reliability.
• Proven model‑based problem‑solving, data‑driven decision making and presentation skills.
• Demonstrated ability to troubleshoot structural and device issues and drive root‑cause resolution.

Required skills

• Semiconductor process integration
• DRAM and NAND technology
• Model‑based root‑cause analysis
• Inline metrology (CD, film loss, mass delta, defectivity, edge/periphery metrics)
• Physics‑based integration methods