Principal Engineer, HIG-HBM Product System Engineering

About the role

Micron is looking for a Principal Engineer to lead the HIG-HBM Product System Engineering team within its Media Health Manufacturing group. The role drives manufacturing and activities for Micron's latest HBM products, including DRAM and interface dies and stacked products, with a focus on quality, cost, cycle time and scale. It leads the manufacturing test flow development and validation, improves device and stacked yield through circuit debug and test coverage optimization, and advances the DFT strategy.

Key responsibilities

• Ensure optimized test coverage on current and future HIG HBM designs and process nodes.
• Develop, validate, characterize and qualify next-generation HBM products, supporting design verification with CAD tools and Verilog simulations.
• Improve manufacturing test yields for device, interface and stacked die issues, reduce test time and resolve yield, qualification and RMA issues.
• Promote innovation and drive changes that give Micron a technical advantage.
• Develop and mentor others, and manage projects with timely delivery.
• Make final decisions on risk analysis and project prioritization.
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams.
• Use AI tools to improve productivity and efficiency.

Required profile

• Bachelor's or Master's degree in Electrical and Electronics Engineering with 8+ years of experience in the semiconductor industry; product engineering experience preferred.
• Strong leadership and technical skills, especially deep circuit analysis and root cause problem solving.
• Good knowledge of statistics and data analysis tools and scripting.
• Proven collaborative work across teams and excellent communication and presentation skills.
• On-site work in Singapore with international travel to the US, Taiwan and Japan.