Principal Engineer / MTS - NAND Dry Etch Process Pathfinding

About the role

Micron's Advanced NAND Process Pathfinding team develops the next generation of memory technology. As a Principal Engineer / Member of Technical Staff (MTS) in Dry Etch, you will lead initiatives and architect and deploy next-generation plasma etch solutions that enable future NAND scaling and novel device architectures. The role suits a technical leader focused on plasma processing, pattern transfer, process integration and technology development.

Key responsibilities

• Develop and refine dry etch processes to meet NAND roadmap criteria for structure, performance and yield.
• Guide development of next-generation etch solutions including high aspect ratio patterning, selective etch, profile control and CD management.
• Evaluate new plasma chemistries, process technologies and hardware to enable future device scaling.
• Collaborate with Process Integration, Thin Films, Wet Etch, Diffusion, Lithography, CMP, Device and other teams to drive technology development and manufacturability.
• Use AI-enabled engineering tools, advanced analytics and digital workflows to speed process development, improve decisions, manage knowledge and boost R&D productivity.

Required profile

• Extensive experience in ICP/CCP plasma etch for advanced semiconductor process development.
• Demonstrated experience developing and qualifying advanced dry etch processes.
• Demonstrated technical leadership and successful engagement with equipment and materials suppliers.
• Preferred: PhD/MS with 7-10+ years in dry etch / semiconductor process development, and experience mentoring engineers and leading technical teams.

Required skills

• Deep understanding of plasma etch equipment, plasma-surface interactions, etch chemistry and profile control.
• Solid foundation in plasma physics, transport phenomena and materials interactions.
• Familiarity with AI/ML, statistical modeling, data analytics and digital engineering methodologies.
• Preferred: experience in high aspect ratio etching, advanced pattern transfer, selective etching and complex structure engineering, and machine learning, automation, predictive or virtual process modeling.