Principal Engineer, NAND Cell Film Process

About the role

Micron is looking for a Principal Engineer in Process Development for its Cell Film process, a leadership role in advancing and implementing cell film processes for NAND memory technology. The engineer defines the technical direction, fosters innovation and ensures new processes integrate successfully into manufacturing, working across teams and contributing to technology roadmaps.

Key responsibilities

• Define and implement the technical strategy for cell film process development, aligned with business and technology objectives.
• Lead multi-functional teams in developing, integrating and scaling thin film processes for advanced NAND devices.
• Oversee end-to-end process module development, focusing on manufacturability, scalability and integration readiness.
• Solve complex technical challenges, including root cause analysis and mitigation of process and device failures.
• Mentor senior engineers and represent the function in technical forums, industry consortia, conferences and joint development projects.
• Drive technology transfer and ramp-up from R&D to high-volume manufacturing.
• Evaluate emerging trends, risks and opportunities, and recommend future investments.
• Lead cost reduction, yield improvement and reliability enhancement programs.

Required profile

• PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering or a related field.
• 5-10 years of experience in thin film research and development for NAND processes, including diffusion, CVD and cell films.
• Experience leading cross-disciplinary teams with integration, device, reliability and manufacturing engineering groups.

Required skills

• Thin film deposition: Atomic Layer Deposition and Chemical Vapor Deposition, process design, optimization and integration.
• Process-device interactions, device scaling and reliability engineering principles.
• Advanced characterization: XRR, ellipsometry, SEM, TEM, SIMS, XPS and electrical evaluation (leakage, impedance, capacitance, breakdown).
• Device physics (MOCAP, MOSFET, 3D NAND), failure analysis and benchmarking.
• Statistical process control (SPC), design of experiments (DOE) and data analytics.
• Regulatory compliance, intellectual property management and technical documentation in semiconductor manufacturing.