Principal Engineer - Process Development, Thin Film (CVD/Diffusion), NAND

About the role

Micron is looking for a Principal Engineer to lead NAND Advanced Thin Films, defining technical direction and driving the strategic advancement and integration of sophisticated structural and electrical film processes into manufacturing. The role requires proven leadership in thin film module development, strong cross-functional influence, deep characterization and correlation capability, and sound judgment on tradeoffs for manufacturability, scaling, yield and reliability.

Key responsibilities

• Define and implement the technical strategy for structural and electrical film process development aligned to business and technology objectives.
• Lead multi-functional teams to develop, integrate and scale thin film processes for advanced NAND structures and devices.
• Oversee end-to-end development of process modules, focusing on manufacturability, scalability and integration readiness.
• Resolve complex technical challenges with significant business impact, including root cause analysis and mitigation of process and device failures.
• Drive technology transfer and ramp-up from R&D to high-volume manufacturing.
• Lead cost reduction, yield improvement and reliability enhancement programs through innovative process and material utilization.
• Mentor senior engineers, represent the function in technical forums and benchmark against industry standards.
• Identify emerging trends, risks and opportunities and recommend future investments, and integrate AI-assisted tools into daily work.

Required profile

• PhD with at least 5 years, or Master's with at least 7 years, or Bachelor's with at least 10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field.
• Demonstrated experience in thin film R&D/PD for NAND, including CVD and diffusion thin films.
• Technical leadership through influence, strong cross-functional and cross-site collaboration, mentorship and executive-ready technical communication.

Required skills

• Mastery of thin film deposition (ALD/CVD) for high-density NAND, including process design, optimization and integration.
• Advanced characterization (XRR, ellipsometry, SEM, TEM, SIMS, XPS) and electrical evaluation (leakage, impedance, capacitance, breakdown).
• SPC, DOE and data analytics for optimization and troubleshooting.
• Ability to drive novel chemistries, materials and hardware solutions such as chamber design, plasma source optimization and gas delivery.