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Principal Engineer - Process Development, Wet, NAND

micron · Fab 10N/X

New
Senior 🇬🇧 English
DOE SPC Y3 Metrology

Job description

About the role

Micron is looking for a Principal Engineer to lead wet process development for NAND memory technology. The role provides technical leadership on project-level initiatives, guides integration and transfer readiness, sets wet process roadmaps aligned to future NAND scaling needs, leads complex experiments and cross-functional execution, mentors senior engineers and strengthens documentation and SOP governance.

Key responsibilities

  • Lead project-level wet process development initiatives and carry out complex experiments to establish robust process windows and improve yield.
  • Work with multiple functions to support technology transfer and ramp-up, and ensure transfer readiness from R&D to manufacturing.
  • Keep track of emerging technologies and industry trends, and engage suppliers and stakeholders to mature process capability (vapor etch, wet strip, dry strip, selective chemical etching).
  • Maintain accurate records, prepare technical reports, contribute to SOPs and knowledge management systems, and ensure safety, quality and IP compliance.
  • Mentor senior engineers, represent the function in technical forums, benchmark against industry standards and identify risks and opportunities.
  • Use AI-assisted tools to improve efficiency and quality, and share AI-enabled improvements within the team.

Required profile

  • PhD with at least 5 years, or Master's with at least 7 years, or Bachelor's with at least 10 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field.
  • Demonstrated experience in wet process research and development in semiconductor technology.
  • Deep understanding of process technologies such as vapor etch, wet strip, dry strip and selective chemical etching.
  • Working knowledge of memory process flow (planar and vertical NAND context).

Required skills

  • Familiarity with electrical evaluation methods and fab metrology tools (CD-SEM, thickness measurement, particle counters).
  • DOE / SPC and data analysis systems (e.g. Y3) to analyse experimental outcomes.
  • Cross-functional collaboration, concise communication and prioritisation in a dynamic environment.

Questions fréquentes

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Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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micron

Fab 10N/X