Principal/Staff Engineer, PCVD Film Deposition, Technology Development

About the role

Micron is seeking a highly motivated engineer for its Technology Development team, which focuses on advanced thin film deposition processes for next-generation memory technologies. The role covers process development to technical leadership, depending on experience level (Principal/Staff). It is based at Fab 10N/X.

Key responsibilities

• Develop and optimize advanced thin film deposition processes (ALD, LPCVD, PECVD, PVD) for cutting-edge device architectures.
• Design and run complex DOE experiments to improve process capability, uniformity and reliability.
• Perform deep root-cause analysis using advanced modeling and characterization techniques.
• Work with integration, other process areas, metrology and equipment engineering teams to solve critical technical challenges.
• Use data analytics and modeling to predict process behavior and speed up development cycles.
• Define technology roadmaps, lead strategic research initiatives, generate intellectual property and influence future deposition technology directions.
• Mentor junior engineers and lead multi-disciplinary technical projects.
• Integrate AI-assisted tools into daily work and share AI-enabled improvements.

Required profile

• Ph.D. or Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics or a related field.
• Master's with at least 8 years or Ph.D. with at least 5 years of hands-on experience in advanced thin film deposition, characterization or a related semiconductor field.
• Experience leading cross-functional projects and mentoring junior engineers.

Required skills

• Expertise in ALD, LPCVD, PECVD and PVD for advanced nodes.
• Understanding of film growth mechanisms, surface chemistry and plasma physics.
• Proficiency in DOE, SPC and advanced statistical analysis.
• Familiarity with TCAD or process simulation tools, and data analytics and machine learning for process optimization.
• Hands-on experience with TEM, SEM, XPS, SIMS, XRD, AFM and ellipsometry.
• Predictive modeling and root-cause analysis.