Probe Integration Engineer (Test Solutions Engineering)

About the role

Micron Technology, Inc. is hiring a Probe Integration Engineer within its Test Solutions Engineering Department, Key Equipment Group. The engineer develops, deploys and supports wafer probe equipment and processes used in manufacturing, with an emphasis on HBM (High Bandwidth Memory), and works on company-wide initiatives for quality, efficiency and standardisation of probe operations.

Key responsibilities

• Deploy first-of-a-kind equipment and process capabilities by evaluating wafer probers, testers and probe cards.
• Collaborate with global teams to establish and implement the best-known probe processes worldwide.
• Work with equipment suppliers and vendors on quality, performance and change management issues.
• Establish manufacturing metrics to drive continuous improvement of equipment performance and processes.
• Develop and deploy new methods or processes to resolve manufacturing issues, and generate equipment specifications for safety and capability.
• Support the integration of first-of-a-kind equipment and processes for high-volume manufacturing.
• Analyse manufacturing data statistically to ensure processes meet quality standards.
• Present information to manufacturing teams and engineering managers, and chair meetings with global manufacturing sites.
• Integrate AI-assisted tools into daily work and share AI-enabled improvements with peers in Manufacturing, Test Engineering, Process Engineering and Quality Assurance.

Required profile

• Bachelor's degree in Electrical, Mechanical Engineering or a related discipline.
• Strong grasp of mechanical and electrical engineering fundamentals.
• Proficiency in statistics, data analysis and design of experiments.
• Self-initiative, ability to manage multiple tasks and work in cross-functional teams.
• Flexibility for off-shift meetings in other time zones; interest in the semiconductor industry is preferred.
• Internship or semiconductor industry experience is a plus; demonstrated leadership is highly desirable.

Required skills

• Thermal systems, machine design, electromechanical controls, electrical circuits, materials selection and mechanical stress analysis.
• Project management and basic knowledge of 3D CAD software.
• Strong working knowledge of MS Office products.
• Digital fluency and AI literacy to use AI tools responsibly.