Process Yield Enhancement Engineer (Physical Failure Analysis)

About the role

Micron is hiring a Process Yield Enhancement (PYE) Engineer in Singapore to support PYE failure analysis for memory products. The role covers electrical fault isolation, physical failure analysis and defect characterization to improve yield, quality and reliability. It works closely with Product Engineering, Process Integration, Test, Manufacturing and Quality teams to identify failure mechanisms, drive root cause investigations and strengthen product robustness.

Key responsibilities

• Perform electrical device characterization, fault isolation and physical failure analysis to identify failure mechanisms and defect locations.
• Analyze electrical and physical failure data to determine root causes, classify defects and support yield and reliability improvement initiatives.
• Collaborate with Product Engineering, Process Integration, Test, Manufacturing and Quality teams to resolve defectivity and product reliability issues.
• Prepare and present technical findings, defect analysis results and failure mechanism reviews to support data-driven decisions.
• Support the development, qualification and adoption of advanced fault isolation and failure analysis techniques.
• Maintain the readiness, utilization and operational effectiveness of fault isolation and failure analysis equipment.
• Document experiments, analysis results and technical learnings according to organizational standards, and contribute to continuous improvement and knowledge sharing.
• Use AI-assisted tools where appropriate and share AI-enabled improvements within the failure analysis function.

Required profile

• B.Sc. or higher in Electrical Engineering, Electronic Engineering, Materials Science or equivalent.
• Experience in semiconductor failure analysis, fault isolation, test engineering, product engineering, yield engineering or related fields is preferred.
• Knowledge of memory technologies such as NAND, DRAM or HBM is advantageous.

Required skills

• Electrical fault isolation, device characterization and failure mechanism analysis.
• Physical failure analysis techniques and defect characterization methodologies.
• Root cause analysis, yield improvement and structured problem solving.
• Data analysis, statistical interpretation and familiarity with AI-enabled or data-driven engineering tools.
• Structured analytical problem solving, clear technical communication, cross-functional collaboration and attention to detail.