Research Associate – High‑Temp Resistant Miniaturized Payload Design

About the role

The Centre for Advanced Robotics Technology Innovation (CARTIN) at NTU is seeking a hardware‑focused Research Associate to develop a compact, heat‑resistant multi‑sensor payload. The payload must survive ambient temperatures of up to 250 °C for ten minutes without external cooling while keeping internal electronics below 55 °C.

Key responsibilities

• Design a compact mechanical housing capable of operating under 250 °C ambient conditions.
• Integrate miniaturized compute, battery, and sensor modules with thermal shielding.
• Perform heat‑simulation, thermal insulation, and shock‑resistance analyses.
• Validate designs through hardware testing in specified environments.
• Strip existing sensor casings and re‑assemble them into custom mounts.

Required profile

• Bachelor’s or Master’s degree in Mechanical Engineering, Mechatronics, or a related field.
• Proven experience in heat‑resistant enclosure design and miniaturized hardware integration.
• Familiarity with fire‑fighting robots or other harsh‑environment robotic platforms is a plus.

Required skills

• Thermal simulation tools such as ANSYS or SolidWorks.
• Mechanical CAD for high‑temperature material design.
• Knowledge of IP65/IP67 sealing standards.
• Experience with fanless computing and embedded system design.
• Miniaturized hardware integration and heat‑resistant enclosure engineering.