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Research Fellow – Advanced MRAM Technology

ntu · Singapore

Senior 🇬🇧 English
Physical vapour deposition (PVD) ULVAC Entron system Optical lithography Electron-beam lithography ICP-RIE Ion milling Programming

Job description

About the role

We are seeking a Research Fellow to join Prof Lew Wen Siang’s laboratory at the School of Physical and Mathematical Sciences, Nanyang Technological University, Singapore. The role focuses on developing advanced MRAM technology for AI memory and smart sensing applications.

Key responsibilities

  • Design and develop high‑performance MRAM devices for advanced computing memory applications.
  • Manage project activities by liaising with international semiconductor companies, research institutes, and foundry partners.
  • Lead preparation of technical write‑ups for quarterly industry press releases.
  • Perform physical vapour deposition (PVD) of MRAM structures on 300 mm wafers using the ULVAC Entron system.
  • Coordinate with circuit designers and semiconductor foundries on CMOS front‑end wafer development and back‑end‑of‑line integration.
  • Conduct MRAM electrical transport measurements, including endurance and retention reliability testing.
  • Fabricate MRAM devices using optical and electron‑beam lithography.
  • Execute device processing with ICP‑RIE and ion‑milling techniques.
  • Analyse structural, electrical and materials characterisation results (SEM, XRD, TEM, etc.).

Required profile

  • PhD in physical sciences or engineering.
  • Minimum 6 years of relevant experience, including PhD research in non‑volatile memory or a closely related area.
  • Strong experience in semiconductor wafer‑level device development.
  • Proficiency in advanced semiconductor processing techniques.
  • Good programming skills; experience in device modelling or simulation is a plus.
  • Strong analytical and data‑visualisation abilities.
  • Ability to work independently under tight timelines with high accuracy.

Required skills

  • Physical vapour deposition (PVD)
  • ULVAC Entron system
  • Semiconductor wafer processing
  • Optical lithography
  • Electron‑beam lithography
  • ICP‑RIE
  • Ion milling
  • Probe‑station electrical measurements
  • Endurance and retention testing
  • Scanning electron microscopy (SEM)
  • X‑ray diffraction (XRD)
  • Transmission electron microscopy (TEM)
  • Programming
  • Device modelling/simulation

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Source : ats:workday

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Published 1 month ago

Expires 1 week from now

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ntu

Singapore