Semiconductor Advanced Packaging Mechanical Design Engineer (TCB/Flip-Chip)

About the role

We are seeking a Mechanical Design Engineer to develop and improve mechanical systems for advanced semiconductor packaging equipment, including TCB and flip‑chip technologies. The role involves creating detailed 3D models, drawings, and documentation while collaborating with cross‑functional teams.

Key responsibilities

• Design mechanical modules such as wafer handling, substrate handling, die ejection, multi‑axis positioning stages, bondheads, and thermal management structures.
• Develop 3D CAD models, detailed manufacturing and assembly drawings, BOMs, and technical documentation.
• Select and specify mechanical and motion components (bearings, linear guides, motors, encoders, actuators, load cells, heaters, sensors, springs, flexures).
• Perform tolerance stack‑up analysis and design reviews for precision assemblies.
• Support machine assembly, alignment, integration, testing, troubleshooting, and customer qualification.
• Investigate machine issues and implement design improvements to enhance accuracy, reliability, cycle time, manufacturability, and cost.
• Maintain engineering documentation and design‑change records.

Required profile

• Diploma or Bachelor’s degree in Mechanical Engineering, Mechatronics, Precision Engineering, Automation or related field.
• At least 2 years of mechanical design experience in semiconductor equipment, precision automation, machine building or motion systems.
• Ability to work on‑site, support assembly, debugging and continuous improvement.

Required skills

• Proficiency with 3D mechanical CAD software (Creo, SolidWorks, Inventor, CATIA, NX or equivalent).
• Strong knowledge of GD&T, fits and tolerances, and tolerance stack‑up.
• Experience with bearings, linear‑motion components, motors, encoders, actuators, load cells, heaters, sensors, springs and flexures.
• Understanding of machining, fabrication processes, material selection and surface treatment.

What we offer

• Competitive salary range SGD 6,000 – 9,000 per month (based on experience and capability).
• Opportunity to work on cutting‑edge semiconductor packaging technologies.
• Collaborative environment with cross‑functional engineering teams.