Semiconductor R&D Engineer – Underfill & Cure Processes

About the role

The role focuses on designing, qualifying, and optimizing advanced underfill and cure processes for high‑density semiconductor packaging. You will work on CoWoS PKG product families and CPO, ensuring technology delivery aligns with the roadmap.

Key responsibilities

• Develop advanced underfill processes (CUF, MUF, NCF/NCP) for CoWoS and CPO products.
• Perform dispensing, material evaluation, and qualification activities.
• Control void and fillet formation, conduct failure analysis and reliability enhancements.
• Lead customer development, technology transfer, and manage project deliverables.
• Drive yield improvement initiatives and perform yield failure analysis.

Required profile

• Bachelor’s degree or higher in engineering or science (e.g., Materials Science, Chemistry, Chemical Engineering, Electronics).
• Minimum three years of R&D or mass‑production experience with underfill processes, dispensing, or encapsulation.
• Proven track record in customer development programs and managing technical requirements.
• Strong understanding of semiconductor packaging, underfill fluid dynamics, and thermal‑mechanical stress control.
• Experience with experimental design (DoE), failure analysis, and technical data reporting.
• Ability to prepare technical documents and deliver presentations to internal and external stakeholders.

Required skills

• Underfill processes (CUF, MUF, NCF/NCP)
• Dispensing and material evaluation
• Encapsulation technology
• Customer development and technology transfer
• Experimental design (DoE)
• Failure analysis (FA)
• Technical documentation and presentation
• Underfill equipment operation (dispenser, cure oven)
• Epoxy/resin material knowledge
• Inspection and reliability characterization tools

What we offer

• Competitive remuneration package
• Comprehensive benefits range