Senior Manager, Package PE - High Bandwidth Memory

About the role

Micron is hiring a Senior Manager for its Package PE, Product and System Engineering function focused on High Bandwidth Memory (HBM). The role combines leadership of the team with hands-on technical work on test coverage, yield and failure analysis, and requires close collaboration with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams.

Key responsibilities

• Lead and develop the team: coach and mentor members, define individual development plans and grow future technical leaders.
• Make final decisions on risk analysis and project prioritization, and lead complex multi-disciplinary projects.
• Improve assembly-related test coverage to reduce Time 0 and package failure DPM and prevent inline fallout, including electrical failure analysis and stress development (DFT).
• Improve HBM yield through test optimization and coverage, working with Technology Development and Packaging organizations.
• Debug and resolve qualification and RMA packaging issues using electrical failure analysis (EFA) and physical failure analysis (PFA).
• Act as subject matter expert and spokesperson for project and technical issues, and share AI-enabled process improvements.

Required profile

• Bachelor's or Master's degree in Electrical, Electronic or Mechanical Engineering with more than 12 years of experience in the semiconductor industry.
• Product engineering and packaging experience preferred; proven leadership in a technical role preferred.
• Strong leadership, problem-solving and communication skills, with a collaborative track record.
• Dedicated, accountable and adaptable to changing roles in a dynamic environment.