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Senior Member of Technical Staff - Dry Etch Process Development (NAND)

micron · Fab 10N/X

New
Senior 🇬🇧 English
Dry etch process development FOAK development DOE SPC Control strategy Plasma etch

Job description

About the role

Micron is looking for a Senior Member of Technical Staff (SMTS) to lead advanced dry etch process development for NAND technologies. The role owns key process levels and modules, turns scaling challenges into executable roadmaps across N / N+1 / N+2 nodes, leads FOAK development, sets robustness and control strategies, and mentors engineers across the dry etch organization.

Key responsibilities

  • Own key dry etch process levels/modules and turn technology challenges into roadmaps across multiple nodes.
  • Lead FOAK dry etch development, including recipe architecture, EPD strategy, control plans and integration alignment.
  • Establish tool robustness mechanisms such as redundancy, controls and monitors to improve manufacturability and maturity criteria.
  • Drive multi-functional execution across Technology Development, Process Integration and Manufacturing, with clear technical status and risk updates.
  • Work with equipment and supplier teams on process-level hardware roadmaps and resolve complex yield, defectivity and integration issues using data and model-based methods.
  • Mentor MTS, interns and early-career engineers on plasma etch fundamentals and data-driven problem solving.
  • Contribute to patents and technical knowledge sharing forums, and integrate AI-assisted tools into daily work where appropriate.

Required profile

  • PhD with at least 12 years, or Master's degree with at least 15 years, of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field in dry etch.
  • Extensive dry etch process development experience.
  • Evidence of external or industry recognition and the ability to represent the organization technically.
  • Track record as an innovation leader: patents, publications, invited talks, and leadership in technical committees or consortia.

Required skills

  • Advanced dry etch process development, FOAK execution and a strong mechanistic understanding of plasma etch physics and chemistry.
  • Strong DOE, SPC and control strategy competency.
  • High-influence leadership, strong mentoring and executive-ready communication.
  • Preferred: AI-enabled analysis and automation capability for process robustness and monitoring improvements.

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Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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micron

Fab 10N/X