Senior Member of Technical Staff, NAND Advanced Thin Films Process Development

About the role

Micron Technology is hiring a Senior Member of Technical Staff for its 3D NAND Advanced Thin Films Process Development team. The role acts as a technical authority, setting strategic direction and leading multi-functional initiatives, driving department-wide impact and influencing technical standards. It involves global projects and mentoring engineers.

Key responsibilities

• Define technical strategy and lead multi-functional projects in structural and electric film development
• Architect solutions and promote innovative technologies across teams
• Influence technical standards and drive process improvements
• Lead advanced process development, fix and integration
• Integrate unit processes into full module packages and validate them, including cross-module interactions and device/process linkages via wafer-level electricals
• Drive root cause analysis, FMEA, SPC and corrective actions that recover yield without trade-offs
• Use characterization tools (SIMS, XPS, TEM, EDX/EELS, electrical stress testing, TDS) to correlate process parameters to device performance and derive reliability and scaling models
• Lead multi-functional teams and vendor engagements, and mentor engineers through training, case studies and hands-on development
• Publish internal papers and BKMs and present to senior leadership

Required profile

• PhD or equivalent in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering or a related field
• 15 to 20 years of experience in thin film R&D for NAND, specifically plasma and thermal CVD for dielectric (including high-k and low-k) and carbon-based films
• Demonstrated leadership in multi-functional development and vendor collaboration
• Proven track record in solution architecture, process-device correlation and mentoring engineers

Required skills

• Advanced proficiency in thin film processing: Plasma Enhanced CVD, Thermal CVD, ALD
• Optimization of structural and electric film hardware and equipment (dielectric and carbon-based films)
• Understanding of process-mechanical-device interactions, reliability modeling and 3D NAND scaling
• Advanced characterization techniques (SIMS, XPS, TEM, electrical stress testing)