Senior Member of Technical Staff - Process Development, Thin Films (CVD/Diffusion), NAND

About the role

Micron is hiring a Senior Member of Technical Staff (SMTS) for its NAND Advanced Thin Films group. The SMTS acts as a technical authority, setting strategic direction, architecting solutions and leading multi-functional initiatives with department-wide impact. The role drives innovation adoption, influences technical standards, leads advanced development, fixing and integration, and builds engineering capability through mentorship.

Key responsibilities

• Define technical strategy and lead multi-functional projects in structural and electrical film development.
• Architect solutions, promote innovative technologies across teams and influence standards and process improvements.
• Lead advanced process development, fixing and integration, validating device/process linkages via wafer-level electricals.
• Solve complex problems across process, structure, hardware and device interactions (RCA, FMEA, SPC, corrective actions).
• Lead vendor engagements to push hardware and process capability, secure resources and set achievements.
• Mentor engineers, build SME pipelines, publish internal papers and BKMs and present to senior leadership.
• Use AI-assisted tools to improve efficiency, quality and effectiveness, and share AI-enabled improvements.

Required profile

• PhD with at least 12 years, or Master's degree with at least 15 years, of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field.
• Extensive thin-film R&D and process development experience.
• Recognized technical authority, strong mentorship and clear executive communication.
• Preferred: demonstrated leadership in multi-functional development and vendor collaboration.

Required skills

• Advanced thin-film processing proficiency (PECVD, thermal CVD, ALD) and hands-on equipment optimization for dielectric and carbon films.
• Characterization and correlation modeling linking process parameters to reliability and scaling behavior.
• Understanding of process-mechanical-device interactions and NAND scaling.