Senior Scientist – Co‑Packaged Optics (Contract)

About the role

The role focuses on developing advanced co‑packaged optics (CPO) platforms for high‑performance optical interconnects. You will work on package‑level and wafer‑level designs, simulation, and validation of optical signal transmission in multi‑chiplet heterogeneous integration.

Key responsibilities

• Develop package‑level optical interconnects using fan‑out silicon interposer, polymer glass or 3D stacking technologies.
• Simulate hybrid bonding interfaces and assess their impact on optical signal transmission.
• Design silicon and alternative‑material lenses for wafer‑scale optical I/Os.
• Estimate optical losses between grating couplers, edge couplers and fiber interfaces.
• Design optical interconnects between GPU‑GPU and GPU‑memory for heterogeneous integration.
• Develop passive fiber‑alignment structures and evaluate high‑density fiber array assemblies.
• Generate package design and test plans, prototype, and validate process flows.
• Characterize fabricated structures using optical testing and metrology tools.

Required profile

• MS or PhD in Engineering Physics or a related field.
• Strong background in optical interconnect modeling.
• Understanding of passive alignment techniques for fiber‑to‑chip coupling.
• Knowledge of wafer‑level processes such as lithography, DRIE, plasma etching, wafer bonding and dicing.

Required skills

• Optical interconnect modeling
• Passive fiber alignment techniques (V‑grooves, alignment pins, trench structures)
• Optical loss analysis and measurement
• Wafer‑level processes (lithography, DRIE, plasma etching, wafer bonding, dicing)
• Photonic packaging platforms (SiPh, InP, TFLN)
• Edge couplers and grating couplers
• Microscope‑based alignment metrology
• Simulation of hybrid bonding interfaces and package stacks
• Design of silicon and alternative‑material lenses
• Characterization using optical testing and metrology tools