Senior/Manager, Technical Program Management

About the role

STATS Chippac is hiring a Senior/Manager, Technical Program Management in Singapore. The role manages new design, qualification and post-sales technical requirements across semiconductor legacy and advanced packaging, including wafer bump, wafer-level CSP, assembly and test. It leads projects across the organisation's technology capabilities and facilities, working closely with Sales, FAE leaders, customers and factory operations, combining technical expertise, customer engagement, business development and end-to-end NPI project management.

Key responsibilities

• Respond to customer technical queries and present technical offerings, roadmaps and advanced packaging capabilities to customers.
• Chair quarterly technical review meetings, prepare agendas and materials, invite customers and follow up on action items.
• Prepare factories for customer engineering visits and engage customers on next-generation packaging projects.
• Analyse customer roadmaps to identify new design wins and feed into the corporate technology roadmap.
• Support RFQ responses with Sales and factory teams, and drive NPI engagement between customers and factories.
• Submit design requests, coordinate design reviews and approvals, and manage the NRE process, including cost inputs, quotations and purchase orders.
• Develop and maintain project schedules for NPI projects and support strategic wins, market growth, revenue, margin, capital expenditure and annual operating plan planning.

Required profile

• Bachelor's degree in engineering or a related discipline; master's degree or above is advantageous.
• At least 5 years of semiconductor OSAT test and assembly experience or related experience (typically 8 years with a bachelor's, 6 with a master's, or 4 with a PhD).
• Proven people and project management experience, strong customer interface skills and a record of meeting project engineering deadlines.
• Excellent English communication skills; French and Mandarin are highly advantageous.

Required skills

• Broad knowledge of semiconductor packaging technology, including wideband, flip chip, wafer-level packaging, wafer bump and test.
• Understanding of package design tools and mechanical, thermal and electrical simulation.
• Proficiency in Microsoft Word, PowerPoint, Outlook and Excel.