Senior/Principal Engineer – OCT Photo Metrology

About the role

Micron is seeking a Senior/Principal Engineer to lead high‑volume manufacturing (HVM) photo and overlay metrology initiatives. The role serves as the technical authority for complex metrology issues across fabs, driving yield, quality, productivity and cost improvements while collaborating with internal teams and suppliers.

Key responsibilities

• Lead HVM photo/overlay metrology yield, quality, productivity, and cost improvement initiatives.
• Resolve complex photo/overlay metrology issues through data‑driven root‑cause analysis.
• Define and deploy Best Known Methods (BKM) for photo/overlay metrology across fabs for HVM and NPI.
• Act as the technical point of contact for cross‑fab, complex photo/overlay metrology customer concerns.
• Drive MOR‑POR gap closure and cross‑fab/node alignment in collaboration with internal teams and suppliers.
• Influence key suppliers and represent OCT in reviews, workshops, and governance forums.

Required profile

• BS/MS/PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering or related field.
• 5+ years (Senior) or 8+ years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing.
• Strong hands‑on experience in photo/overlay metrology engineering (yield, quality, productivity, cost improvement).
• Proven experience solving challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching.
• Experience defining and deploying Best Known Methods across tools, nodes, or fabs.
• Ability to act as a technical point of contact for blocking issues and lead multi‑function problem solving.
• Data‑driven approach with strong communication skills; comfortable working with global teams and suppliers; flexibility for travel and overseas assignments.

Required skills

• Photolithography
• Photo metrology
• Overlay metrology
• CDU (Critical Dimension Uniformity)
• Reticle correction
• MMM (Multi‑Mode Metrology)
• Destack analysis
• Yield matching
• Best Known Methods (BKM) deployment
• Data‑driven root‑cause analysis
• AI‑assisted tools for metrology improvement