Shift Engineer Lead, NAND TD RDA and Metrology

About the role

Micron is hiring a Shift Engineer Lead for its Fab 10N/X facility, covering NAND Transfer Die (TD) RDA and metrology. The role leads the shift team, supports process development and acts as first and second line of defense for shift critical issues such as lot holds, dispositions, excursions, line-downs and tool downs.

Key responsibilities

• Safety and quality: complete required safety training, adhere to safety and regulatory policies, proactively identify and resolve safety and quality issues, and drive reductions in injuries, hazards and environmental incidents.
• Shift operations: act as first and second line of defense for shift critical issues, partnering with TD 1st shift Process Development, HVM Ops and multi-functional teams to set priorities, resolve issues and meet goals, and ensure robust reaction plans and timely updates.
• Develop and deliver plans to resolve on-shift process and tool issues, improve output and mitigate quality risks, working with process development engineering, equipment development engineering and suppliers.
• Process development support: lead the shift team in supporting RAM cycle time goals, redundancy fanout, wafer shipments, SWR execution and data collection, critical lots health checks, and guide technicians on complex tasks.
• Use data-driven analysis to solve yield and quality problems, and support business processes and control of chronic tool/process issues (SPC, alarms, inventory).
• People leadership: drive continuous improvement, manage projects, coach and develop direct reports, manage workload and well-being, and communicate priorities with engineering and engineering management.

Required profile

• Master's or bachelor's degree in engineering or a related science field.
• 5 years of experience in the wafer fabrication industry.
• Ability to lead shift teams in fast-paced environments and deliver area and department goals.
• Demonstrates Micron leadership behaviors and values.

Required skills

• Strong problem-solving, data analysis and SPC/process control knowledge.
• Knowledge of yield and defect mechanisms, process flow interactions and recipe database management risks.
• Proficiency in process control and automation tools such as SPC, recipe management and manufacturing execution systems, and interest in automation and AI agent adoption.