Staff Engineer - HBM Package Product Engineering

About the role

Micron is hiring a Staff Engineer for its Heterogeneous Integration Group's High Bandwidth Memory (HBM) Product Engineering team. The role leads and develops a high-performing team driving package and HBM product engineering activities, within a global group of product engineers focused on quality, cost, cycle time and scale. The position is based on site in Singapore with international travel to Taiwan, the US and Japan.

Key responsibilities

• Improve assembly-related coverage in manufacturing flows to reduce Time 0 and field DPM and prevent inline fallout
• Improve HBM cube yield through test optimization and coverage, working with Technology Development and Packaging
• Lead cross-functional initiatives to raise cumulative yield and quality
• Debug and resolve qualification and RMA packaging issues using electrical and physical failure analysis
• Work with Fab, Technology Development and advanced packaging teams to set up a robust process conversion business process, and advise PDE teams on new conversions to reduce cost and increase yield
• Mentor team members and promote innovation and technical decision-making on risk analysis and project prioritization
• Collaborate with Fab, HBM Technology Development, HBM Design, System Development and Quality/Reliability teams to deliver end products
• Develop and validate AI/ML models to improve quality, cost, cycle time and scale, and share AI-enabled improvements

Required profile

• Bachelor's or Master's degree in Electrical, Electronic or Mechanical Engineering
• Competent technical skills, especially problem-solving with root cause analysis through deep circuit analysis
• Good knowledge of statistics and data analysis tools and scripting
• Proven collaborative track record and strong sense of responsibility
• Excellent communication and presentation skills
• Passion for people leadership and continuous learning
• Willingness to work on site in Singapore with travel to Taiwan, the US and Japan