Staff Engineer - Process Development, Thin Film (CVD/Diffusion), NAND

About the role

Micron is hiring a Staff Engineer for its NAND Advanced Thin Films process development team. The engineer owns defined portions of the process space (dielectric and carbon film processes via CVD and diffusion) and drives robustness, capability and integration readiness. The role suits someone with strong hands-on deposition and characterization skills who can turn experimental results into scalable process improvements.

Key responsibilities

• Develop, optimize and characterize thin film processes (CVD/Diffusion) to meet performance, reliability and manufacturability targets, running well-designed experiments and analyzing data.
• Support scaling of dielectric and carbon film processes across nodes and platforms.
• Own parts of a process module or sub-module, tracking margins, sensitivities and integration risks, and drive issue resolution for process and tool problems.
• Work with integration and device teams to ensure compatibility and structural/electrical performance, correlate material, structural and electrical data, and support failure analysis and root-cause investigations.
• Build hands-on knowledge of dielectric/carbon film equipment, support tool qualifications, upgrades and transfers, and partner with suppliers to improve stability and capability.
• Communicate results through reports and reviews, escalate risks with data-driven recommendations, mentor junior engineers and share knowledge.
• Use AI-assisted tools to improve efficiency, quality and effectiveness, and share AI-enabled improvements within scope.

Required profile

• PhD with at least 3 years, or Master's with at least 5 years, or Bachelor's with at least 7 years of relevant experience in Electrical Engineering, Materials Science, Chemical Engineering, Physics or a related field.
• Demonstrated thin film R&D / process development experience and the ability to link process conditions to material properties and device behavior.
• Preferred: understanding of NAND thin film structure and electrical needs.

Required skills

• Thin film deposition fundamentals (CVD/Diffusion) and materials, chemistry and process physics.
• Familiarity with fab metrology and film characterization methods (structural, mechanical, optical, electrical).
• Working knowledge of plasma processes, vacuum systems and chemical reactions.