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Staff/Principal Engineer, Advanced Package Metrology - Real-Time Defect Analysis

micron · Fab 10A

New
Senior 🇬🇧 English
Python SQL Power BI Visual Basic E3 FDC RMS SPC DOE

Job description

About the role

Micron's Advanced Packaging Technology Development (APTD) team is looking for an Advanced Packaging Metrology-RDA Engineer to join its Fab 10A site. The role develops and enables inspection and metrology techniques for advanced packaging technologies, identifies and diagnoses yield-related issues, and coordinates the development and launch of new metrology and real-time defect analysis (RDA) technologies with peers and partners. It also covers equipment evaluation and long-range strategy for the advanced packaging technology roadmap.

Key responsibilities

  • Develop and optimize metrology recipes for semiconductor processes, keeping them accurate and efficient for production, and run strategies for process monitoring, sampling and continuous improvement
  • Set inspection methodologies and best-known methods (BKM) for metrology, and perform in-line characterization and validation of recipes
  • Use data analysis tools such as Power BI to report on recipe status and project progress, and continuously analyze data for improvements
  • Manage metrology tools against performance indicators and quality standards, and drive readiness of the defense line with control plans, OCAPs and SPC charts
  • Work early with APTD and with Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering and Global Quality to integrate manufacturing processes
  • Apply AI-assisted tools and insights responsibly to improve efficiency, quality and effectiveness, and share AI-enabled improvements

Required profile

  • PhD with at least 2 years of a Master's degree and 5 years of experience, or a Bachelor's degree with at least 7 years of relevant experience in electrical, materials, chemical, physics or a related engineering field
  • Semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging
  • Hands-on experience with wafer/assembly tools or metrology/RDA systems
  • Strong analytical and problem-solving skills, and strong communication, leadership and stakeholder management skills
  • Ability to work independently and cross-functionally in a fast-paced environment
  • Baseline digital fluency and role-appropriate AI literacy

Required skills

  • Python, R and SQL for statistical analysis, process modeling and data analytics
  • Visual Basic for automation and tool integration
  • Familiarity with E3, FDC (Fault Detection and Classification) and RMS (Recipe Management System)
  • Data analytics supporting SPC, DOE, defect analysis and dashboarding

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Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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micron

Fab 10A