Staff/Principal Engineer - CMP Advanced NAND

About the role

Micron is hiring a Staff/Principal Engineer for its CMP Advanced NAND research and development dry etch team in Singapore. The engineer develops and optimizes chemical mechanical planarization (CMP) procedures to improve product quality and reliability for next-generation memory parts, and owns the process roadmap to meet program and yield goals. The role works closely with process integration and other process areas such as wet etch, CVD, diffusion, metals, lithography and dry etch.

Key responsibilities

• Develop and optimize CMP procedures, focusing on process margins needed to meet mature yield goals for 3D NAND parts
• Carry out fundamental research, consumables development and hardware evaluation, and test processes for novel applications
• Run experiments to widen process margins and evaluate the manufacturability of next-node solutions
• Collaborate with vendors to develop processes that meet integration requirements for current and next-generation 3D NAND nodes
• Incorporate proven manufacturing methods into early development of upcoming nodes
• Design and implement advanced process monitoring and control methodologies
• Lead complex, multi-functional projects and advise management on major technical issues
• Mentor new hires and less experienced colleagues on CMP fundamentals, process development and Micron systems
• Work with Procurement and Operations teams, and lead quality, process/yield, cost and productivity improvement meetings
• Use AI to streamline workflows and support data-driven decisions

Required profile

• Masters or PhD with 5-10 years of experience, or Bachelor's degree with 7-12 years, in the semiconductor industry with a CMP background in 300mm wafer fabrication
• Hands-on experience operating CMP equipment such as AMAT LKP, EBARA-300X and next-generation CMP tools, optical metrology, profilometry, polishing slurries, conditioners and pads
• Experience in dielectric/metal CMP process development on 3D NAND or other memory technology
• Strong oral and written communication, collaboration, self-driven project management and mentoring abilities

Required skills

• CMP process development on 3D NAND or other memory technology
• Optical metrology and profilometry
• Understanding of integration and structural constraints related to film deposition and upstream/downstream processes
• Highly desirable: knowledge of planar and vertical NAND process flows, and interest in data science, modelling and AI adoption