Test Engineer - Failure Analysis

About the role

Micron is hiring a Test Engineer in its MSB location. The role covers failure analysis of memory and storage devices, working with advanced microscopy and testing tools, scripting test data analysis and collaborating with process owners and product teams to drive quality improvements.

Key responsibilities

• Perform electrical and physical failure analysis for device anomalies, customer returns and qualification failures.
• Use advanced FA tools such as FIB/EDX, SEM, ion millers, CSAM, 2D/3D X-ray, EMMI systems, micro-probers and bench testers.
• Analyze test data failures using Bash/Python scripting in a Unix environment, and analyze electrical signatures and physical defects to resolve failure mechanisms.
• Collaborate with process owners and product teams to drive improvement actions, and develop new FA techniques to reduce turnaround time and increase accuracy.
• Drive continuous improvement, ensure lab safety and chemical handling compliance, and maintain 6S standards in the FA lab.
• Prepare detailed FA reports, present findings to requestors, MRB and multi-functional teams, and guide FA technicians and distribute workload.
• Work with vendors on tool upgrades and explore automation, data analytics and AI to speed up investigations.

Required profile

• Bachelor's or advanced degree in Engineering.
• Strong analytical, logical and critical thinking skills; effective communicator across all levels.
• Growth mindset and interest in the semiconductor industry; internship or semiconductor experience is a plus.
• Knowledge of the semiconductor industry and Micron is preferred.

Required skills

• Bash and Python scripting in a Unix environment.
• Failure analysis tools: FIB/EDX, SEM, ion millers, CSAM, 2D/3D X-ray, EMMI systems, micro-prober and bench tester.
• Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly.