Wafer Fab Process Engineer

About the role

Broadcom is looking for a Wafer Fab Process Engineer to lead process development, optimization and transfer to manufacturing, aiming to meet yield, quality, cost and reliability targets. The role works closely with equipment, integration, quality and R&D teams.

Key responsibilities

• Own and drive advanced process modules such as thin film deposition (metal/passivation), wafer thinning, thermal oxidation, diffusion and implantation.
• Lead yield improvement and defect reduction initiatives using statistical and DOE methodologies.
• Drive new process integration (NPI) and process transfer to high-volume manufacturing.
• Perform root cause analysis and implement corrective and preventive actions.
• Define process control plans, SPC strategies and OCAP execution.
• Mentor junior engineers and technicians, interface with suppliers on process and material improvements, and collaborate across functions.

Required profile

• Bachelor's or Master's degree in Engineering (Electrical, Chemical, Materials or related).
• At least 5 years of semiconductor wafer fab process experience in thin film (metal/passivation) or thermal (oxidation, diffusion, implantation).
• Demonstrated leadership in cross-functional technical projects.
• Preferred: PhD in Engineering, Six Sigma certification (Green/Black Belt), and experience supporting 4" to 6" wafer scaling or equivalent manufacturing transition.

Required skills

• SPC, DOE and FMEA
• Statistical data analysis tools
• Strong analytical, problem-solving and communication skills