Yield Enhancement Engineer - HBM NPI (Package Development Engineering)

About the role

Micron is looking for a Yield Enhancement (YE) Engineer within its Package Development Engineering (PDE) team. The role covers yield monitoring, excursion management and yield stabilization during High Bandwidth Memory (HBM) new product introduction (NPI). It works closely with Process Integration, MRDA, Process Engineering, Assembly/Test Manufacturing and Quality teams, and acts as a hands-on yield owner during NPI builds.

Key responsibilities

• Account for HBM NPI builds across Post Wafer Finishing, Assembly and test through defect breakdown and Physical Failure Analysis (PFA) submissions.
• Work with Process Integration to identify defects and brainstorm Continuous Improvement Plans (CIP).
• Learn NPI processes, phase gates and yield best practices, and assist in maintaining yield dashboards and trackers.
• Analyze and report yield deviations, support block runs and partial conversion builds, and work with Process Control Systems to set up SPC or FDC charts for yield loss ratio monitoring.
• Brainstorm improvement opportunities with colleagues from other departments and use tools such as Auto-diagnostics to find yield improvements.
• Integrate AI-assisted tools into daily work to improve efficiency, quality and effectiveness, and share AI-enabled enhancements with the team.

Required profile

• Bachelor's or master's degree in engineering or a related discipline.
• 0-2 years of experience in semiconductor manufacturing or engineering.
• Strong interest in yield analysis and data-driven problem solving.
• Internship or experience in the semiconductor industry is a plus; demonstrated leadership and a track record of impact are highly desirable.
• Knowledge of the semiconductor industry and Micron is preferred.

Required skills

• Basic knowledge of statistics, SPC or data analysis tools.
• Ability to use AI-enabled tools responsibly for research, analysis, problem solving and operational tasks.
• Strong analytical, logical and critical thinking skills, and effective cross-level communication.