Yield Enhancement Engineer – Package Development

About the role

As a Yield Enhancement Engineer within Micron’s Package Development Engineering team, you will own yield monitoring, excursion management, and yield stabilization for High Bandwidth Memory (HBM) new product introductions. The role works across the product lifecycle from first silicon through ramp‑up and early high‑volume manufacturing, collaborating with Process Integration, Process Engineering, Assembly/Test, and Quality teams.

Key responsibilities

• Account for HBM NPI builds across post‑wafer finishing, assembly, and test, performing defect breakdown and physical failure analysis.
• Analyze yield deviation issues, trigger corrective actions, and support block‑run and partial‑conversion yield analysis.
• Maintain yield dashboards, trackers, and integrate AI‑assisted tools to improve efficiency.
• Collaborate with Process Control Systems to develop SPC/FDC charts for shift‑left monitoring.
• Identify and propose yield improvement opportunities using software tools such as Auto‑diagnostics.

Required profile

• Bachelor’s or master’s degree in engineering or a related discipline.
• 0–2 years of experience in semiconductor manufacturing or engineering.
• Strong analytical, logical, and critical‑thinking skills with a growth mindset.
• Effective communication and ability to collaborate across all levels.

Required skills

• Yield analysis and defect breakdown.
• Statistical Process Control (SPC) and Fault Detection & Classification (FDC).
• Data analysis tools and basic statistics.
• AI‑assisted tools and Auto‑diagnostics software.
• Physical Failure Analysis (PFA) techniques.