Yield Enhancement Physical Failure Analysis Technician

About the role

Micron NAND Technology Integration (NTI) Singapore is looking for a Yield Enhancement Physical Failure Analysis Technician to provide physical failure analysis for next-generation Micron products. The role identifies and communicates failure mechanisms and supports root cause analysis of yield issues, and helps transfer physical failure analysis processes into production. The Yield Enhancement group is multi-disciplinary, combining engineers from chemical, materials, electrical, statistics and device physics.

Key responsibilities

• Delayer failing devices using a variety of wet and dry techniques
• Use focused ion beams and STEM/TEM for cross-section analysis and SEM for top-down analysis
• Generate slice and view images to give inline process improvement feedback
• Recognise and raise awareness of new failure mechanisms
• Work with EFA engineering to quickly identify visual defects for yield issues
• Innovate ways to improve efficiency and shorten the time to visualise root causes
• Interpret and summarise data and present it verbally and in writing to engineers
• Build and improve new techniques and test new processes to improve productivity
• Own the PFA tools and keep them running at maximum uptime
• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality and effectiveness

Required profile

• ITE or diploma in an electronics-related field or equivalent experience
• Knowledge of semiconductor device physics, fabrication, operation, architecture and statistics
• Self-motivated, analytical and problem-solving skills, with excellent written, communication and presentation skills
• Continuous improvement mindset

Required skills

• Acid hood operation and polish wheel
• Delayer techniques with wet/dry etch
• SEM, dual-beam FIB and STEM lamella creation