3D NAND Process Integration Engineer

About the role

Micron Technology is hiring a NAND Module Process Integration Engineer for its Singapore R&D department. You will design, develop, integrate and implement process solutions that improve the yield and quality of next-generation 3D NAND products, with competitive cost and performance within the required timeline.

Key responsibilities

• Identify and quantify key module deficiencies and technology gaps, and lead cross-functional teams to address them
• Improve current process flows and develop solutions that meet product requirements and manufacturability
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability
• Coordinate activities at the manufacturing site to secure funding for experiments and conversions, and communicate decisions to R&D, Product Engineering and Manufacturing partners
• Run development projects evaluating new integration schemes for alpha and derivative part types, and establish proof of concept for future tech nodes at the manufacturing facility
• Lead quarterly yield summits and monthly program reviews, summarizing complex problems and aligning R&D, Manufacturing and senior management
• Assist in transferring new technology from R&D to manufacturing, including documentation and training of module fundamentals
• Use AI-assisted tools to improve efficiency, quality and effectiveness, and share AI-enabled improvements with colleagues

Required profile

• At least 2 years of experience in the semiconductor industry
• BS, MS or PhD in Material Science, Electrical Engineering, Microelectronics, Chemical or Physics Engineering, or a related field
• Ability to understand PI modules on new NAND technologies and their structural and electrical fail mechanisms
• Self-motivated, able to work independently in a demanding and dynamic environment

Required skills

• Direct experience with non-volatile memories (NAND) and the NAND process flow, including common yield and reliability issues (desirable)
• Experience across the semiconductor R&D product life cycle from design to manufacturing (desirable)
• Data analysis, visualization or simulation software such as JMP or Tableau (desirable)