Central Engineering PYE Failure Analysis Engineer

About the role

Micron Technology Inc. is looking for a Failure Analysis (FA) Engineer for its Central Engineering (CE) Product Yield Enhancement (PYE) team. The engineer provides full fault isolation and failure analysis support for qualifications, customer returns, new device introductions and test failures, becoming the subject matter expert on fault isolation and physical failure analysis methods. The role works closely with Product Engineering teams and with Process Integration, Product, Test and Quality Reliability Assurance Engineering groups.

Key responsibilities

• Perform sophisticated electrical device characterization to determine electrical fail mechanisms.
• Operate fault isolation equipment to narrow down failure defect locations.
• Conduct physical failure analysis to identify and classify physical defects.
• Hypothesize electrical or process fail mechanisms from detailed electrical fail models and characterization, supporting process improvement.
• Collaborate with teams from frontend to backend and the Global Quality department to resolve defectivity issues.
• Prepare and present electrical and physical failure mechanisms weekly to drive continuous improvement.
• Develop and implement new fault isolation and physical failure analysis techniques.
• Coordinate the maintenance and high uptime of fault isolation and failure analysis tools.
• Integrate AI-assisted tools and insights into daily work and share AI-enabled improvements.

Required profile

• Bachelor's, Master's or PhD degree in Electrical/Electronic Engineering or Material Science, or equivalent experience.
• Proven experience as a team player with strong analytical and problem-solving skills.
• Excellent communication skills, able to present complex information in large meetings.
• Ability to support shift rotation as required.

Required skills

• Knowledge of fault isolation equipment, techniques and physical failure analysis is a significant advantage.
• Strong understanding of NAND/DRAM/HBM devices and Fab processes is desirable.
• Exposure to AI/machine learning or data analytics in engineering or manufacturing is beneficial.