Dry Etch DMTS - Advanced NAND

About the role

Micron is hiring a Distinguished Member of Technical Staff (DMTS) Dry Etch engineer for its Next Generation NAND research and development team in Fab 10N/X, Singapore. This is a senior individual contributor role leading advanced dry etch process development and technology transfer for NAND, working closely with process integration and areas such as Wet Etch, CVD, Diffusion, Metals, Lithography and CMP.

Key responsibilities

• Lead advancements in dry etch technology and module development, acting as technical expert for dry etch process, hardware and applications in NAND development at F10, Singapore.
• Define the equipment roadmap and work with suppliers to build a hardware roadmap for the next generation of NAND dry etch.
• Benchmark Micron's NAND dry etch capability against industry standards and share insights on dry etch trends, tool capabilities and integration risks.
• Mentor SMTS/STS engineers and less experienced engineers, and resolve complex NAND yield, defectivity and integration challenges.
• Represent Micron Singapore at international conferences and technical forums, and contribute to the Technical Leadership Program.
• Lead multi-functional teams, simplify problems with model-based approaches, champion AI-based solutions and present roadmaps to executives.
• Integrate AI-assisted tools into daily work and provide project status updates to upper management.

Required profile

• 15-20 years of experience in dry etch process development in R&D (NAND, DRAM or logic) moving into manufacturing, with 10-15 years in memory products; PhD or BS/MS with over 18 years of relevant experience.
• Demonstrated leadership in problem solving and experience managing technical projects.
• Experience leading supplier negotiations and solving scalability problems of deep high aspect ratio silicon/dielectric etches.
• Preferred: data science basics, Python coding or AI-related experience.

Required skills

• Knowledge of plasma physics, plasma chemistry and transport or surface phenomena.
• Understanding of plasma dry etch reactors (RF sources, chemistries).
• Statistical process control and analysis.
• Strong computer skills, including MS Office and SAS software such as JMP.