Dry Etch Staff/Principal Engineer - Advanced NAND

About the role

Micron is hiring a Dry Etch Staff/Principal Engineer for its Next Generation NAND research and development team. The engineer works on critical dry etch modules and collaborates with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography and CMP. The goal is to own the process roadmap to meet program and yield targets.

Key responsibilities

• Lead dry etch unit process and critical module development, including HAR, tier-by-tier etches, WL contacts and staircase structures
• Develop and innovate dry etch processes to meet structural and electrical specifications
• Collaborate with and lead cross-functional teams to solve complex structural problems
• Present process and technology roadmaps for current and future technology nodes
• Interact with other process areas, identify opportunities and guide other areas' technology roadmaps
• Take part in cross-functional task forces and act as a resource and mentor to peers in dry etch technology and project management
• Update upper management on project status and impacts

Required profile

• Demonstrated aptitude for a research and development environment
• 3-10 years of dry etch process development in R&D transferring to manufacturing, or a Master's/PhD with 4-10 years of relevant experience, or a Bachelor's degree with 7-12 years of relevant experience
• 2-3 years of NAND, DRAM or logic module development experience
• Leadership in problem solving and experience managing technical projects
• Ability to lead supplier head-to-heads

Required skills

• Knowledge of plasma physics, plasma chemistry, transport or surface phenomena
• Understanding of RF plasma dry etch reactors and chemistries
• Statistical process control and analysis
• Solving scalability problems of deep high aspect ratio silicon/dielectric etches, including tailored pulsing schemes
• Data science basics, Python coding and AI coding preferred
• MS Office and SAS software such as JMP