Engineer – HIG-HBM Product Engineering (Media Health Reliability Coding)

About the role

As a key member of Micron’s High Bandwidth Memory (HBM) Product Engineering Media Health team, you will develop and code reliability test programs for the latest HBM devices and packages. The role focuses on both intrinsic and extrinsic reliability assessments, ensuring product quality, cost efficiency and fast cycle times.

Key responsibilities

• Design, code, and debug test programs for wafer‑level burn‑in, pWLRx, ELFR and other reliability flows on DRAM, interface and stacked dies.
• Develop and maintain extrinsic DPM (Time‑0 and Field DPM) and intrinsic reliability test suites.
• Collaborate with Fab, HBM Design, System Development and Quality teams to guarantee full test coverage.
• Analyze engineering data using in‑house statistical tools for validation and risk assessment.
• Define interface hardware specifications and validate new interface boards.
• Promote innovative reliability features, code‑base optimisation and technical improvements.

Required profile

• Fresh or entry‑level graduate in Electrical Engineering, Computer Engineering or a related discipline.
• Strong problem‑solving ability and attention to detail.
• Excellent communication skills for cross‑functional collaboration.
• Willingness to work in a fast‑paced, results‑driven environment.

Required skills

• Test program development and debugging.
• Statistical data analysis for reliability validation.
• Hardware specification definition and board validation.
• Debugging of interface hardware.

What we offer

• Competitive monthly salary ranging from SGD 5,000 to 6,900.
• Opportunity to work on cutting‑edge HBM technology in a global semiconductor leader.
• Professional growth through cross‑functional projects and mentorship.