Engineer, High Bandwidth Memory (HBM) & NPI

About the role

Micron is looking for an Engineer to join its Package Development Engineering Team for Advanced Packaging in Singapore. This individual contributor position supports next-generation memory and HBM packaging technologies, mainly helping new products move from development to high-volume manufacturing. The role works closely with stakeholders such as the Development Team and Manufacturing, and with supplier teams across Micron's global network.

Key responsibilities

• Integrate AI-assisted tools and insights into daily work to improve efficiency, quality or effectiveness, and share AI-enabled improvements within your scope of work.
• Apply engineering and statistical methods to speed up learning cycles from Design of Experiments (DOE) through product qualification.
• Partner with Advanced Package Technology Development (APTD) and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).
• Perform risk assessments, including Failure Mode & Effect Analysis (FMEA), and implement control plans and corrective actions for abnormal conditions.
• Enable smooth technology transfer from development to high-volume manufacturing.

Required profile

• PhD in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering or a related discipline.
• Operations support, including shift and weekend coverage, is required.
• Strong analytical, logical and critical thinking skills, and ability to communicate effectively across all levels.
• Growth mindset, leadership and a track record of impact are highly desirable.
• Knowledge of the semiconductor industry and Micron is preferred.

Required skills

• Ability to use AI-enabled tools responsibly for research, analysis, content creation, problem solving and operational tasks.
• Preferred: familiarity with MES systems, automation and data analytics tools such as JMP and Python.