Engineering Execution Manager, HBM HIG

About the role

Micron Technology is looking for an Engineering Execution Lead/Manager in its HBM HIG (High Bandwidth Memory, DRAM Engineering Group) organization. The role guides a HBM product through concept, design, NPI and HVM phases by facilitating cross-functional life-cycle management, building and maintaining detailed development schedules and driving tactical execution. It provides leadership and direction for the Product Development Team (PDT) by defining and prioritizing projects, analyzing issues and risks, and identifying resources needed to meet timelines and deliverables.

Key responsibilities

• Integrate all aspects of HBM development within the extended HIG and TPG teams and with partner organizations.
• Partner with Technology Development, Design, Process, APTD, PE and Manufacturing teams to drive development progress and alignment.
• Work with the PMO to build and maintain detailed development schedules from pre-silicon to HVM and drive tactical execution.
• Communicate development status, priorities and challenges regularly across the organization.
• Set and prioritize tactical expectations according to milestones and stakeholder needs.
• Act as product point of contact, identify task owners, manage development documentation and consolidate inputs for hardware readiness and capacity planning.

Required profile

• Bachelor's or Master's degree in Electrical or Computer Engineering, or in manufacturing/supply chain related fields.
• 5+ years of relevant technical, manufacturing or cross-functional team leadership experience.
• Excellent written and verbal communication skills, including with technical and senior management audiences.
• Innovative mindset open to improving processes and products.

Required skills

• Comfortable with data analysis methods and data visualization, able to communicate data-backed conclusions.
• Familiarity with JIRA, Confluence and project management software tools.