Intern - PIE PI (Product Integration Engineering, Process Integration)

About the role

Micron is offering an internship in its Process Integration Engineering (PIE) and Process Integration (PI) team in Singapore, under the project Advanced Memory Process Integration Improvement Exploration and Device Reliability Study (NAND / DRAM / HBM). The internship gives a structured learning opportunity in advanced semiconductor memory manufacturing, covering reliability concepts, failure mechanisms and engineering methods used to evaluate and improve device performance and product quality.

Key responsibilities

• Learn the fundamentals of semiconductor memory device manufacturing and process integration, and how process interactions affect device performance, yield and reliability
• Study reliability evaluation methodologies, failure mechanism characterization and introduction to failure analysis and engineering problem solving
• Explore data analytics tools, dashboards and visualization platforms used in semiconductor manufacturing
• Learn automation and AI/ML applications supporting process monitoring, reliability assessment and continuous improvement
• Observe cross-functional collaboration between Process Integration, Process Development, Manufacturing, Yield Enhancement, Product Engineering and Failure Analysis teams
• Produce technical documentation summarizing reliability studies, engineering methodologies and key learning outcomes
• Write an analysis report with data-driven findings and trends from manufacturing or reliability datasets
• Evaluate potential process, reliability, yield or automation improvement opportunities
• Demonstrate the application of analytics, automation or AI/ML tools to an engineering problem

Required profile

• Minimum 4-month summer internship (preferred period May to August 2027)
• Basic understanding of semiconductor fabrication processes (preferred)
• Interest in manufacturing technology, reliability engineering, data analytics or process optimization
• Willingness to learn and collaborate in a team environment
• Course of interest: Engineering and Science (all relevant disciplines)

What we offer

• Exposure to advanced memory technologies (NAND, DRAM, HBM) and reliability engineering
• Opportunity to be considered for full-time employment after the internship, depending on performance and business needs