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MTS - Dry Etch, MTS, PD, Advanced NAND

micron · Fab 10N/X

New
Senior 🇬🇧 English
Plasma dry etch Statistical process control Python JMP SAS MS Office

Job description

About the role

Micron is hiring a Member of Technical Staff (MTS) for its Next Generation NAND research and development Dry Etch team. The role leads critical modules and works closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography and CMP. It involves operating dry etch chambers and managing the process roadmap to reach program and yield goals.

Key responsibilities

  • Lead development of Dry Etch technology and become an area expert
  • Develop and innovate dry etch processes to meet structural and electrical specifications
  • Work with hardware teams to define the equipment roadmap for current and upcoming NAND products
  • Collaborate and lead multi-functional teams to solve complex structural problems
  • Predict future issues and build mitigation plans
  • Contribute to the Technical Leadership Program and mentor less-experienced engineers
  • Work on modules such as HAR, tier-by-tier etches, WL contacts and staircase
  • Drive collaborative solutions, guide other areas' technology roadmaps and act as a resource for colleagues
  • Update upper management on project status and impacts

Required profile

  • 6-10 years of experience in dry etch process development in R&D moving into manufacturing
  • 4-5 years of NAND, DRAM or Logic module development experience
  • PhD or equivalent with a minimum of 10 years in dry etch process development, or a Bachelor's/Master's degree with a minimum of 12 years of applicable experience
  • Demonstrated leadership in problem-solving and experience managing technical projects
  • Interest in a research and development environment

Required skills

  • Knowledge of plasma physics, plasma chemistry, transport or surface phenomena
  • Understanding of plasma dry etch reactors (RF sources, chemistries)
  • Statistical process control and analysis
  • Solving scalability problems of deep high aspect ratio silicon/dielectric etches, including tailored pulsing schemes
  • Data science basics, Python coding and AI coding preferred
  • MS Office and SAS software such as JMP

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Source : ats:workday

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Published 1 day ago

Expires 1 month from now

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micron

Fab 10N/X