New Product Introduction Engineer

About the role

The NPI Engineer develops new semiconductor assembly processes and qualifies customer products for manufacturing. This role leads process development for die bonding, wire bonding, and related assembly activities to ensure each process is robust, repeatable, and ready for manufacturing transfer before production release.

Key responsibilities

• Lead technical development of new customer products through engineering qualification.
• Review customer specifications, drawings, bills of materials, and manufacturing requirements.
• Assess manufacturability and recommend suitable assembly processes.
• Develop the manufacturing flow for new products.
• Define process acceptance criteria and qualification requirements.
• Develop and optimise die bonding and wire bonding processes.
• Establish process parameters and operating windows.
• Create machine programs for die bonders and wire bonders.
• Optimise dispensing, curing, plasma cleaning, and other supporting assembly processes.
• Evaluate new materials, tooling, fixtures, and consumables.
• Plan and execute Design of Experiments (DOE) activities.
• Conduct engineering validation builds and analyse process capability.
• Define critical process parameters and establish process controls before production release.
• Participate in technical discussions with customers and support Design for Manufacturability reviews.
• Prepare engineering reports, technical presentations, and support customer qualification builds.
• Provide technical recommendations throughout project development.
• Prepare process specifications, machine setup sheets, and process recipes.
• Develop engineering and qualification reports and preliminary work instructions.
• Support PFMEA and Control Plan development.

Required profile

Required skills

• Die bonding
• Wire bonding
• Process development for semiconductor assembly
• Design of Experiments (DOE)
• PFMEA
• Control Plan development
• Machine programming for die bonders and wire bonders
• Dispensing, curing, and plasma cleaning techniques
• Material, tooling, and fixture evaluation
• Process specification and documentation