New Product Introduction Engineer

About the role

The New Product Introduction (NPI) Engineer will lead the transition of semiconductor products from development to high‑volume manufacturing. Working closely with R&D, product engineering, quality and production teams, the engineer ensures that new products are manufacturable, robust, and meet customer requirements.

Key responsibilities

• Lead NPI builds from prototype through qualification to mass production.
• Set up processes, qualify materials, and prepare lines for new products.
• Develop and review process flows, work instructions, FMEA, and control plans.
• Coordinate engineering builds, monitor progress, and resolve technical issues.
• Provide technical support for backend processes such as lithography, wet processing, die preparation, pick‑and‑place, reconstitution, and molding.
• Troubleshoot yield issues, equipment problems, and process excursions.
• Analyze SPC and DOE data, implement CAPA, and drive continuous‑improvement initiatives.
• Collaborate with equipment, quality, production, and supply‑chain teams to ensure seamless operations.
• Interface with suppliers for material and equipment qualification and support internal and customer audits.

Required profile

• Bachelor’s degree in Electrical Engineering, Materials Science, Chemical Engineering, Mechanical Engineering, or a related field.
• At least 5 years of experience in semiconductor manufacturing, preferably in backend or advanced packaging.
• Proven experience in NPI, process development, or high‑mix manufacturing environments.
• Strong problem‑solving abilities and familiarity with root‑cause analysis tools.
• Ability to work in a fast‑paced, high‑volume manufacturing setting.

Required skills

• Lithography, wet processing, die preparation, pick‑and‑place, reconstitution, molding.
• Statistical Process Control (SPC), Design of Experiments (DOE), data analysis.
• Root‑cause analysis tools: 8D, Fishbone, Failure Mode and Effects Analysis (FMEA).
• Advanced packaging technologies such as fan‑out and wafer‑level packaging.
• Automation and Manufacturing Execution Systems (MES).
• Six Sigma and Lean methodologies (certification a plus).