Principal Engineer - 3D NAND Process Integration

About the role

Micron's Advanced NAND Technology (ANT) Singapore team is looking for a Principal Engineer to drive the future NAND technology roadmap through advanced pathfinding and integration. The role sits in a cutting-edge R&D environment where next-generation memory technologies are developed by bridging device concepts, materials and process integration into manufacturable solutions. It uses AI-enabled data analytics and model-driven methods to tackle complex scaling challenges.

Key responsibilities

• Drive 3D NAND integration and the technology roadmap, leading pathfinding and advanced architecture enablement.
• Lead end-to-end development from conception to technology validation, including learning vehicles, characterization and debug.
• Solve complex integration challenges with data-driven, AI-assisted and model-based approaches, identifying technology gaps and enabling solutions.
• Define and optimize module and process architecture (electrical targets, process flows, design rules) to meet product requirements.
• Collaborate across Device, Probe, Test, Design and Operations to drive performance, yield learning and execution.
• Promote technical innovation through process improvements, patents and publications, and build strong global networks.

Required profile

• MS or PhD in Electrical Engineering, Materials Science, Physics, Chemical Engineering or a related field.
• Strong foundation in semiconductor device physics and process integration.
• Experience in memory (NAND/DRAM), CMOS/logic, or emerging/embedded memory technologies.
• Proven ability in experiment design, data analysis and problem-solving.
• Ability to work across cross-functional R&D teams, with strong communication and collaboration skills.
• Demonstrated innovation mindset; exposure to advanced data analytics or AI/ML techniques is a plus.